Automated Author ProfileRyuichi Inaba
Mitsubishi Materials Corporation
Ryuichi Inaba
Current S-Index
Sum of Dataset Indices for all datasets
Average Dataset Index per Dataset
Average Dataset Index per dataset
Total Datasets
Total datasets for this author
Average FAIR Score
Average FAIR Score per dataset
Total Citations
Total citations to the author's datasets
Total Mentions
Total mentions of the author's datasets
S-Index Interpretation
The S-Index (Sharing Index) is a comprehensive metric that represents the cumulative impact of all your datasets. It is calculated as the sum of Dataset Index scores across all your claimed datasets.
What it means:
- A higher S-index indicates greater overall impact of your datasets relative to typical datasets in their fields of research
- The S-Index grows as you add more datasets or as existing datasets gain more citations and mentions
- It provides a single number to track your research data impact over time
Current S-Index: 1.7 (sum of 1 dataset Dataset Index scores)
More information here.
S-Index Over Time
Cumulative Citations Over Time
Cumulative Mentions Over Time
Datasets
The five types of surface roughness of the electroplated copper films was measured using a white light interferometer (Ametek). Each electrodeposited copper film was obtained via constant-current electrolysis in copper sulfate bath. The concentrations of sulfuric acid (H2SO4) and copper sulfate (CuSO4) were in the ranges of 20–180 g/L and 140–220 g/L, respectively. Standard additives for copper sulfate bath (JCU, CU-BRITE_RF) and 50 ppm chloride ions were introduced into the bath to ensure the stable formation of the electrodeposited copper film. A 70 mm × 70 mm sized masked copper plate was used as the working electrode and a Ti-coated mesh was used as the counter electrode. The electrodeposition time was controlled such that the total capacity was 8.1 C/cm2.
Authors
- Ryo Tamura ;
- Ryuichi Inaba ;
- Mami Watanabe ;
- Yutaro Mori ;
- Makoto Urushihara ;
- Kenji Yamaguchi ;
- Shoichi Matsuda