Automated Author ProfileHokin, Carolyn
Hokin, Carolyn
Current S-Index
Sum of Dataset Indices for all datasets
Average Dataset Index per Dataset
Average Dataset Index per dataset
Total Datasets
Total datasets for this author
Average FAIR Score
Average FAIR Score per dataset
Total Citations
Total citations to the author's datasets
Total Mentions
Total mentions of the author's datasets
S-Index Interpretation
The S-Index (Sharing Index) is a comprehensive metric that represents the cumulative impact of all your datasets. It is calculated as the sum of Dataset Index scores across all your claimed datasets.
What it means:
- A higher S-index indicates greater overall impact of your datasets relative to typical datasets in their fields of research
- The S-Index grows as you add more datasets or as existing datasets gain more citations and mentions
- It provides a single number to track your research data impact over time
Current S-Index: 0.7 (sum of 2 datasets Dataset Index scores)
More information here.
S-Index Over Time
Cumulative Citations Over Time
Cumulative Mentions Over Time
Datasets
This dataset contains the raw data extracted from Fizeau interferometer measurements of fused silica and ULE wafers undergoing isochronal annealing testing for stress field stability after ultrafast laser stress figuring. The data was collected between December 2024 and June 2025 at the James C. Wyant College of Optical Sciences, University of Arizona, in Tucson, Arizona. The data was analyzed for changes to the first 15 Zernike coefficients occurring between the “Nominal” measurement and subsequent thermal cycles as a simple difference (e.g., value in a “50C” column minus value in the “Nominal” column equals measured change in Zernike term after cycling to 50-degrees Celsius). Induced surface figure changes as a result of ULSF were evaluated as the difference between the “Before ULSF” and “After ULSF” columns for all samples that underwent the ULSF procedure. Additionally, equibiaxial, antibiaxial, and shear stress was calculated after each thermal cycle from the change in the first three Zernike coefficients (Z4-Z6), respectively, using a modified version of Stoney’s equation. These changes were then plotted in the figures and reported in the tables that appear in the article "Stability of Ultrafast Laser-Induced Stress in Fused Silica and Ultra-Low Expansion Glass.”
For inquiries regarding the contents of this dataset, please contact the Corresponding Author listed in the README.txt file. Administrative inquiries (e.g., removal requests, trouble downloading, etc.) can be directed to [email protected]
Authors
- Chalifoux, Brandon D ;
- Hokin, Carolyn
This dataset contains the raw data extracted from Fizeau interferometer measurements of fused silica and ULE wafers undergoing isochronal annealing testing for stress field stability after ultrafast laser stress figuring. The data was collected between December 2024 and June 2025 at the James C. Wyant College of Optical Sciences, University of Arizona, in Tucson, Arizona. The data was analyzed for changes to the first 15 Zernike coefficients occurring between the “Nominal” measurement and subsequent thermal cycles as a simple difference (e.g., value in a “50C” column minus value in the “Nominal” column equals measured change in Zernike term after cycling to 50-degrees Celsius). Induced surface figure changes as a result of ULSF were evaluated as the difference between the “Before ULSF” and “After ULSF” columns for all samples that underwent the ULSF procedure. Additionally, equibiaxial, antibiaxial, and shear stress was calculated after each thermal cycle from the change in the first three Zernike coefficients (Z4-Z6), respectively, using a modified version of Stoney’s equation. These changes were then plotted in the figures and reported in the tables that appear in the article "Stability of Ultrafast Laser-Induced Stress in Fused Silica and Ultra-Low Expansion Glass.”
For inquiries regarding the contents of this dataset, please contact the Corresponding Author listed in the README.txt file. Administrative inquiries (e.g., removal requests, trouble downloading, etc.) can be directed to [email protected]
Authors
- Chalifoux, Brandon D ;
- Hokin, Carolyn