Version 1.0

gluethickness_horizontal_compression.tab

Tapia Camú, Cristóbal;Claus, Marian;Aicher, Simon

Description

Data corresponding to the measured bond line thickness over the horizontal wide finger surface located at the compression side of the connection. Coordinates (x,y) and bond line thickness in [mm].

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Metrics

Dataset Index

0.7

FAIR Score

31%

Citations

Mentions

Metrics Over Time

Publication Details

DOI

10.18419/darus-2153/4

Publisher

DaRUS

Assigned Domain

Subfield

Mechanical Engineering

Field

Engineering

Domain

Physical Sciences

Confidence Score

42%

Source

Scholar Data Model

Normalization Factors

15.38

CTw

1.00

MTw

1.00