Submission of Reliable aluminum wire-bonded SiC power modules with laminated AlCu stress buffers
View DatasetMei, Yunhui
Description
All the raw data of the power cycling tests are collected in the attached files.
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Metrics Over Time
Publication Details
Subfield
Electronic, Optical and Magnetic Materials
Field
Materials Science
Domain
Physical Sciences
Confidence Score
42%
Source
Scholar Data Model