Dataset on the Fabrication and Performance of Thermal Interface Materials Based on Polyimide/Mesocarbon Microbead Composites

This dataset comprehensively documents the experimental data related to the fabrication, characterization, and performance evaluation of high-performance thermal interface materials (TIMs) based on polyimide (PI) and mesocarbon microbead (MCMB) composites. The dataset encompasses the entire process, including material preparation, structural characterization, thermal and mechanical performance testing, and thermal stability analysis. The materials were fabricated using advanced techniques such as directional freezing, high-temperature thermal annealing, and graphitization. The dataset includes data obtained from scanning electron microscopy (SEM), Raman spectroscopy, X-ray diffraction (XRD), thermogravimetric analysis (TGA), laser flash analysis (LFA), and infrared thermal imaging.The dataset contains the following key components:Material Preparation Parameters: Mass fractions of PI and MCMB, directional and non-directional freezing parameters, annealing temperatures, and durations.Structural Characterization Data: SEM images, Raman spectra, XRD patterns, and elemental analysis results.Thermal Performance Data: Thermal conductivity (K) measurements, including in-plane (IP) and through-plane (TP) values, obtained using LFA.Mechanical Properties Data: Compressive stress-strain curves and elastic modulus values.Thermal Stability Data: TGA curves showing weight loss as a function of temperature.Real-Time Thermal Conduction Data: Temperature distribution data recorded using an infrared thermal imager during heating experiments.