Published on 26 October 2018

Data for: Plasmonic Nanoparticle-based Epoxy Photocuring

Everitt, Henry

Description

Contents Appendix A. Electromagnetic simulations Appendix B. Heat Transfer simulations Appendix C. Influence of parameters Appendix D. Aluminum nanoparticles: practicality and stacking effects Appendix E. Bond strength with no nanoparticles References

Citations (1)

https://doi.org/10.1016/j.mattod.2018.09.005
MDC
Cited on 01 July 2019
Weight: 1.23

Mentions (0)

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Metrics

Dataset Index

1.8

FAIR Score

65%

Citations

Mentions

Metrics Over Time

Publication Details

DOI

10.17632/xp9cwv6mpb.1

Publisher

Mendeley

Assigned Domain

Subfield

Mechanical Engineering

Field

Engineering

Domain

Physical Sciences

Confidence Score

54%

Source

Scholar Data Model

Keywords

Composite MaterialsAdhesive BondingLocalized Surface Plasmon ResonanceEpoxy

Normalization Factors

15.38

CTw

1.00

MTw

1.00