Optical Profilometer Dataset for Diced Surfaces Obtained with Wafer Dicing Machine at Varying Feed Velocities
Rennpferdt, Lukas;Bohne, Sven;Trieu, Hoc Khiem
Description
Fused silica wafers (1mm thickness) were diced with a wafer dicing machine (Disco DAD3350) at different feed velocities to analyze the impact on the surface roughness. The surface roughness was measured with an optical profilometer (Keyence VK-X3000) in white light interferometer mode. Raw data from the interferometer measurements and a README file are included in this dataset.
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Metrics Over Time
Publication Details
DOI
Publisher
TUHH Universitätsbibliothek
Subfield
Computational Mechanics
Field
Engineering
Domain
Physical Sciences
Confidence Score
64%
Source
Scholar Data Model
Keywords
Wafer DicingOptical ProfilometerSurface RoughnessTechnology::620: Engineering::620.1: Engineering Mechanics and Materials Science