Published on 01 January 2020

Materials Data on Ho(CuS)3 by Materials Project

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Description

Ho(CuS)3 crystallizes in the trigonal R-3 space group. The structure is three-dimensional. Ho3+ is bonded to six equivalent S2- atoms to form HoS6 octahedra that share corners with twelve equivalent CuS4 tetrahedra, edges with three equivalent HoS6 octahedra, and edges with six equivalent CuS4 tetrahedra. All Ho–S bond lengths are 2.74 Å. Cu1+ is bonded to four equivalent S2- atoms to form CuS4 tetrahedra that share corners with four equivalent HoS6 octahedra, corners with six equivalent CuS4 tetrahedra, edges with two equivalent HoS6 octahedra, and edges with three equivalent CuS4 tetrahedra. The corner-sharing octahedra tilt angles range from 17–55°. There are a spread of Cu–S bond distances ranging from 2.35–2.43 Å. S2- is bonded in a 6-coordinate geometry to two equivalent Ho3+ and four equivalent Cu1+ atoms.

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Mentions (0)

Metrics

Dataset Index

0.3

FAIR Score

13%

Citations

0

Mentions

0

Metrics Over Time

Publication Details

DOI

Publisher

LBNL Materials Project; Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)

Assigned Domain

Subfield

Electrical and Electronic Engineering

Field

Engineering

Domain

Physical Sciences

Confidence Score

96%

Source

Open Alex

Keywords

36 MATERIALS SCIENCEcrystal structureHo(CuS)3Cu-Ho-S

Normalization Factors

FT

13.46

CTw

1.00

MTw

1.00